Easterhegg

Easterhegg 2024

The 21st Easterhegg in Regensburg, where the Rabbit Chaos Adventure tied campus, laptop, and badge challenges to a public badge repository and hardware-hacking area.

OTH Regensburg · Germany · 2024

Easterhegg 2024 RCA Badge

A source-backed Easterhegg 2024 badge record for the Rabbit Chaos Adventure: the event wiki points to challenges on campus, laptop, and badge, while the public repository preserves RCA badge files, schematics, Gerbers, parts exports, media, and printable add-ons.

Lifecycle

Add-ons & Upgrades

hardware add-on

RCA badge add-ons

Participant reporting says CTF success yielded cool add-ons for the Easterhegg badge and that the badge could later be soldered in the hackerspace.

Compatibility: Easterhegg 2024 RCA Badge

Easterhegg 2024 RCA Badge archived source

multi-board hardware package

Badge/head/hood/arm/back PCB set

The repository exposes separate schematic PDFs and Gerber ZIPs for the badge, head, hood, arm, and back boards, making the RCA artifact a multi-board kit rather than a single PCB record.

Compatibility: Easterhegg 2024 RCA Badge

Operational history

Issues & Camp Impact

missing rights-cleared image · local project policy · needs licensed original replacement

No Easterhegg 2024 RCA Badge image is published because the current public source trail has not been paired with a reusable original badge or artifact photo or official upstream raster render with source URL, license or permission basis, attribution, and processing notes.

The Germany record remains source-backed and image-free rather than copying source-page media, documentation screenshots, event photos, social media, placeholders, or generated approximations.

source-depth caveat · repository, talk, wiki, field report, and participant reports · repository reviewed; firmware still not asserted

The repository review confirms schematics, Gerbers, LCSC parts exports, media, 3D-print files, NE556-related challenge material, and multi-board RCA structure, but this pass still does not claim a complete firmware architecture or full electrical BOM extraction.

The dossier is now specific about the public artifact package while still avoiding unsupported firmware and chip-level claims beyond what the repository and reports expose.

Resources

Sources