Easterhegg
The 21st Easterhegg in Regensburg, where the Rabbit Chaos Adventure tied campus, laptop, and badge challenges to a public badge repository and hardware-hacking area.
OTH Regensburg · Germany · 2024
A source-backed Easterhegg 2024 badge record for the Rabbit Chaos Adventure: the event wiki points to challenges on campus, laptop, and badge, while the public repository preserves RCA badge files, schematics, Gerbers, parts exports, media, and printable add-ons.
Lifecycle
The event wiki describes Rabbit Chaos Adventure challenges on campus, laptop, and the badge, making the badge part of the game surface.
Rabbit Radio reports that challenge progress unlocked more parts for the PCB, turning puzzle progress into a physical badge build-up mechanic.
Participant reporting says CTF success yielded cool add-ons for the Easterhegg badge and that the badge could later be soldered in the hackerspace.
The back-cover README documents printable cover and switch-cap files, optional additional LEDs, switched-power pickup pins, LED mounting, masking, and snap-on assembly.
The repository exposes separate schematic PDFs and Gerber ZIPs for the badge, head, hood, arm, and back boards, making the RCA artifact a multi-board kit rather than a single PCB record.
The closing talk lists the wider RCA kit around the badge, including lanyard, business card, two sticker variants, postcard, and booklet.
Attendee writeups place badge soldering and SMD practice inside the event hardware-hacking area, with help and conversation around PCBs and badges.
Operational history
The badge-linked challenge was praised by some participants but also created discoverability and inclusion friction for others.
The Germany record remains source-backed and image-free rather than copying source-page media, documentation screenshots, event photos, social media, placeholders, or generated approximations.
The RCA build-up mechanic was part of the fun, but also created expectations around badge parts and prize/reward availability.
The dossier is now specific about the public artifact package while still avoiding unsupported firmware and chip-level claims beyond what the repository and reports expose.