Add-on dossier
A linkable lifecycle record for hardware expansions, app ecosystems, firmware upgrades, cases, radio parts, and post-event badge experiments.
DAP mode presents the badge as a CMSIS-DAP probe for pyOCD, OpenOCD, Keil, and SWD target debugging while keeping a CLI serial interface available.
Badge context
Repository documentation for normal, CMSIS-DAP, and DFU USB modes and related debugging workflows.
Repository documentation for voltage glitching, crowbar, SWD, DAP, AVRISP, and analog-monitoring workflows.
MIT license file for repository software and documentation; no badge photo is reused from this repository in this catalogue pass.
Official LayerOne source for the Pasadena conference context, 2025 dates, Pasadena Hilton venue, and electronic-badge ticketing.
Official teaser post for the 2025 badge.
Official HHV page identifying the 2025 electronic badge as the LayerOne 2025 GLiTCh BadgE and linking the repository plus challenge context.
Raw README source for RP2040, ICE40 FPGA, voltage glitcher, crowbar, SWD, AVRISP, ADC streaming, USB modes, build scripts, hardware notes, and documentation caveats.
Public source repository for the badge hardware, firmware, documentation, scripts, and license.
Source trail
Technical guide source for glitch, crowbar, SWD, DAP, AVRISP, and analog-monitoring workflows.
Primary technical source for RP2040, ICE40 FPGA, voltage glitcher, crowbar, SWD, AVRISP, ADC streaming, USB modes, flashing, and project notes.
Technical guide source for normal, CMSIS-DAP, and DFU USB behavior.
MIT license source for repository software and associated documentation; no repository images are reused as badge-gallery images.
Public badge source repository for hardware, firmware, documentation, and scripts.
Official LayerOne teaser source for the 2025 badge.
Official village source identifying the LayerOne 2025 GLiTCh BadgE, repository link, on-site support, and HHV challenge context.
Official source for LayerOne conference context, 2025 date and venue details, and electronic-badge ticketing.